The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Aug. 15, 1997
Junichi Matsunaga, Tokyo, JP;
Ryuji Ninomiya, Tokyo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.