The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Dec. 08, 1997
Hiroyuki Moriuchi, Tokyo, JP;
Tomonari Otsuki, Tokyo, JP;
Sadao Kuboi, Tokyo, JP;
Kiyoshi Matsui, Hadano, JP;
Takayuki Ono, Hadano, JP;
Morio Suzuki, Hadano, JP;
DDK Ltd., , JP;
Hitachi, Ltd., , JP;
Abstract
An electronic part, particularly a microstructure contact having an overall length of the order of 5 mm for an electrical connector or the like is provided with a nickel oxide layer portion having a nickel oxide layer of the order of 50 to 5000 .ANG. in thickness formed by anode oxidizing process using a solution mainly consisting of an alkaline solution. The nickel oxide layer portion is located between a terminal portion of the electronic part to be soldered as in a surface mounting process and a contact portion continuous to and extending from the terminal portion. The nickel oxide layer has a width of the order of 0.2 to 1 mm in the longitudinal direction of the contact and has a performance preventing the flowing of molten solder, thereby effectively preventing the flowing and wicking due to wetting of solder of the solder-plated portion toward the other portions as in the surface mounting process.