The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Feb. 04, 1997
Applicant:
Inventors:
Shogo Mizumoto, Ohtsu, JP;
Yutaka Tsukada, Shiga, JP;
Assignee:
International Business Machines, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
29852 ; 29830 ; 29831 ; 29847 ; 29853 ; 174257 ; 174258 ; 174259 ; 174264 ; 427 97 ;
Abstract
A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an effective circuit path between respective points on the two layers. One or both via holes can be filled with either an electrically conductive material (e.g., copper paste) or a nonconductive material (e.g., resin).
Mizumoto, Shogo. (1999). Multilayer printed wiring board and method of making same (U.S. Patent No. 5956843). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5956843
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile