The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
Apr. 17, 1997
Sumie Sato, Kanagawa-ken, JP;
Jun Ohmori, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device mountable in a module supporter. According to the present invention, a semiconductor substrate has a plurality of semiconductor modules, where each semiconductor module has a semiconductor chip covered with a protective material, such as resin, on a first surface and a connector formed on a second surface which is electrically connected to the semiconductor chip. An adhesive layer is applied to the first surface of the substrate. The adhesive layer has a plurality of opening portions arranged to positionally correspond to the plurality of semiconductor modules on the substrate. The substrate and the adhesive layer are cut into individual substrates each having the semiconductor chip so that each semiconductor module has the adhesive layer on a periphery of the protective material. Individual substrates containing a semiconductor module are bonded to the supporter having a concave portion for holding the semiconductor module.