The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 1999

Filed:

Feb. 28, 1997
Applicant:
Inventors:

Seiji Ichikawa, Tokyo, JP;

Junichi Tanaka, Tokyo, JP;

Tomoaki Hirokawa, Tokyo, JP;

Taku Sato, Tokyo, JP;

Tomoaki Kimura, Tokyo, JP;

Satoshi Murata, Tokyo, JP;

Tsutomu Kubota, Tokyo, JP;

Takeo Ogihara, Tokyo, JP;

Kenji Uchida, Tokyo, JP;

Kenji Watanabe, Tokyo, JP;

Tsutomu Noguti, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438106 ; 438110 ; 438120 ; 438121 ;
Abstract

In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.


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