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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5956560 B1

PDFFull Text
Date of Patent:
Sep. 21, 1999

Filed:

Jan. 15, 1997

Tungsten-copper composite powder

Applicant:
Inventors:

Leonid P Dorfman, Athens, PA (US);

David L Houck, Towanda, PA (US);

Michael J Scheithauer, Ulster, PA (US);

Muktesh Paliwal, Owego, NY (US);

Gail T Meyers, Leraysville, PA (US);

Frank J Venskytis, Monroeton, PA (US);

Assignee:

Osram Sylvania Inc., Danvers, MA (US);

Attorney:

Clark; Robert F.

Primary Examiner:

Ngoclan Mai

Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
419 38 ; 419 47 ;
Abstract

A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.

Find Patent Forward Citations

Dorfman, Leonid. (1999). Tungsten-copper composite powder (U.S. Patent No. 5956560). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5956560

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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