The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Mar. 20, 1997
Anilkumar Chinuprasad Bhatt, Johnson City, NY (US);
Thomas Richard Miller, Endwell, NY (US);
Allen Frederick Moring, Vestal, NY (US);
James Paul Walsh, Vandling, PA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An improved method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed, and at least one added layer of metallization is then applied to assure an entirely conductive opening between the member's opposing surfaces. The temporary support assures effective support for the dry film photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps. As taught herein, the entire sidewall portions defining the opening previously occupied by the temporary support portion are metallized to provide enhanced electrical characteristics for the finished product.