The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Feb. 05, 1998
Mark W Haley, Rio Medina, TX (US);
Albert H Liu, San Antonio, TX (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
An electrostatic chuck device for clamping a semiconductor wafer substrate during processing of the semiconductor wafer includes a power source, at least one negative pole, and a plurality of positive poles. Each positive pole selected from the plurality of positive poles is electrically separated from the negative pole. Also provided is a plurality of fuses, each fuse of the plurality of fuses is coupled to an associated positive pole included in the plurality of positive poles. Each fuse is further coupled to the power source. In some embodiments, each positive pole is electrically separated from the negative pole by an insulating epoxy. In other embodiments, the plurality of positive poles are connected to each other in parallel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile