The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Oct. 29, 1997
James G Salter, Columbus, GA (US);
James E Clark, San Diego, CA (US);
David W Swanson, Escondido, CA (US);
George F Nasworthy, Jr, Leucadia, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A method for joining two materials together to form a compact leak-resistant seal, particularly suited for use in thermal inkjet print cartridge ink reservoirs. The seal employs a shrink fit to clamp the two materials together. The method includes the steps of forming the first material into a desired first shot structure, placing the first shot structure in a second shot mold, and injecting the second material into the mold under adequate pressure and at an appropriate temperature. The second material has a high degree of mold shrinkage. Upon cooling, the second material shrinks tightly onto the first shot structure to form a molded joint which keeps air out and ink in when wetted and during normal shipping, storage, and operating conditions.