The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Mar. 04, 1997
Applicant:
Inventor:
Harufumi Kobayashi, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257666 ; 257676 ; 257784 ;
Abstract
Of ends of a plurality of inner leads disposed around a semiconductor chip shaped substantially in the form of a rectangle, the ends of the inner leads, which correspond to the corners of the rectangle, are provided so as to approach in the direction of the semiconductor chip. Owing to the provision referred to above, bonding wires for connecting electrical connections between the semiconductor chip and the ends of the inner leads can be prevented from drifting upon a mold process.
Kobayashi, Harufumi. (1999). Semiconductor device and method of manufacturing same (U.S. Patent No. 5952710). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5952710
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile