The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Apr. 12, 1994
Applicant:
Inventors:
Yoshitsugu Morita, Chiba Prefecture, JP;
Junji Nakanishi, Chiba Prefecture, JP;
Ken Tanaka, Chiba Prefecture, JP;
Toshio Saruyama, Chiba Prefecture, JP;
Assignee:
Dow Corning Toray Silicone Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08L / ;
U.S. Cl.
CPC ...
525476 ; 525477 ; 525478 ; 528 27 ;
Abstract
There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising (A) 100 weight parts of a curable resin; and (B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula