The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Nov. 14, 1996
Fouad E Kiamilev, Charlotte, NC (US);
Ashok V Krishnamoorthy, Middletown, NJ (US);
Richard G Rozier, Charlotte, NC (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
A high-performance photonic chipset for computing 1-D complex fast Fourier transform (FFT) calculations. Flip-chip integration is used to combine submicron CMOS ICs with GaAs chips containing 2-D arrays of multiple-quantum wells (MQW) diode optical receivers and transmitters on each chip in the set. Centralized free-space optical interconnection offers higher throughput rates, greater external bandwidth and reduced chip count compared to conventional electronic FFT devices using hard-wired interconnection between chips. The memory addressing used provides one-to-one interconnections for memory transfers between computational stages that are compatible with several known three-dimensional free-space optoelectronic packaging technologies and dual-port memory is used to permit simultaneous read-write access to adjacent addresses in the data banks needed by each stage.