The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Oct. 29, 1996
Hidekazu Manabe, Tokyo, JP;
Kaoru Ishihara, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.