The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1999
Filed:
Sep. 19, 1997
Michael J Griffin, IV, Poughkeepsie, NY (US);
Lovell B Wiggins, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor package structure that includes placing self-adjusting stand-offs between the substrate and sealband of the cap, such that the gap between the cap and the chip can be controlled, thereby improving the thermal and fatigue performance of the overall package. The height of the stand-off is varied by controlling the application (i.e., the temperature and the timing) of the heat that is used by the soldering process normally used in the generation of solder joints. The control of the soldering procedure is calibrated to optimize the amount of the stand-off which is dissolved, melted and spalled until the optimum height of the stand-off is reached.