The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1999
Filed:
Dec. 16, 1997
Tetsuro Washida, Tokyo, JP;
Katsunori Ochi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A module mounted in relative high density with semiconductor devices is disclosed. The module includes a mounting substrate which has a hole section; a first semiconductor device having bump electrodes which protrude from one principal surface of a package and lead terminals electrically connected to the bump electrodes; a second semiconductor device which also has bump electrodes that can be structurally and electrically coupled with the bump electrodes of the first semiconductor device and where this second semiconductor device is able to be located in the hole section of the mounting substrate, and where the first semiconductor device is able to be supported on the mounting substrate through the lead terminals; and where the bump electrodes of both semiconductor devices are electrically connected to each other.