The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 1999

Filed:

Dec. 04, 1997
Applicant:
Inventors:

Dilipkumar Nandlal Shah, Wescosville, PA (US);

William Edward Starner, Nesquehoning, PA (US);

Assignee:

Air Products and Chemicals, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08F / ; C08K / ;
U.S. Cl.
CPC ...
5283393 ; 528183 ; 528189 ; 528208 ; 5283395 ; 528340 ; 528342 ; 525420 ; 5254205 ; 525423 ; 525435 ; 525526 ; 524100 ; 524178 ; 524567 ; 524569 ;
Abstract

Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.


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