The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1999
Filed:
Nov. 21, 1997
Edwin Lawrence, Gardiner, NY (US);
Iqbal K Bansal, Sandy Hook, CT (US);
SiBond, L.L.C., St. Peters, MO (US);
Abstract
A wafer backing insert for use in a free mount semiconductor polishing apparatus and process is disclosed wherein the wafer backing insert behind the semiconductor substrate has a diameter less than the diameter of the semiconductor substrate being polished to allow the removal of material at the edge of the substrate to be less than the overall average removal of material across the entire substrate. In a preferred embodiment, the process of the present invention utilizing a wafer backing insert having a diameter less than the diameter of the semiconductor substrate being polished is used in combination with a first polishing step utilizing a conventional wafer backing insert to control the resulting thickness and overall TTV of the polished substrate.