The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 1999

Filed:

Aug. 29, 1997
Applicant:
Inventors:

Chandrakant D Patel, Fremont, CA (US);

Frederic Amerson, Los Altos, CA (US);

Christian Belady, McKinley, TX (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361700 ; 16510421 ; 16510433 ; 174 152 ; 257715 ; 257722 ;
Abstract

A low-cost high aspect ratio skived heatsink with high performance ducting in order to optimize airflow over and through the skived fins. The skived heatsink can additionally have formed channels or extruded holes for insertion of a heatsink pipe therein. A thermally enhanced compound is used between the heatsink and heatpipe to provide a low thermal resistance between the parts. The heatpipe is expanded to optimally fill the channel or hole by injecting pressured fluid into the pipe before sealing the pipe with working fluid, or via heating of a sealed pipe and expansion of the working fluid therein. A partitioned cooling system can additionally be used, one partitioned section having high volume airflow with low static pressure, and another partitioned section using higher velocity ducted air over a plurality of skived heatsinks.


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