The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 1999

Filed:

Jul. 08, 1997
Applicant:
Inventors:

Yong-Kwon Kim, Cheongju, KR;

Jun-Yong Kim, Busan, KR;

Assignee:

LG Semicon Co., Ltd., Cheongju, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451-9 ; 451-5 ; 451 10 ; 451 41 ; 451 26 ; 451288 ;
Abstract

An improved sensing device and method for leveling a semiconductor wafer in a chemical mechanical polishing apparatus, which easily detects the change of pressure from a semiconductor wafer contacting with the polishing surface. The present invention includes a polishing platen having a polishing pad on the upper leveled surface thereof, and fixed to a rotatable platen driving shaft. A carrier is rotatably provided on the upper surface of the polishing platen and holding the semiconductor wafer such that the lower surface of the semiconductor wafer is uniformly contacted with the polishing pad. A pressure detecting sensor senses the pressure applied from the semiconductor wafer on the polishing pad and outputs a corresponding signal.


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Kim, Yong-Kwon. (1999). Sensing device and method of leveling a semiconductor wafer (U.S. Patent No. 5944580). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5944580

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