The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1999
Filed:
Sep. 30, 1996
Applicant:
Inventor:
Werner Spaeth, Holzkirchen, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S / ;
U.S. Cl.
CPC ...
438 29 ; 372107 ; 438 27 ;
Abstract
A method for manufacturing a semiconductor component having a semiconductor body secured to a support plate comprises securing the support plate on a surface of the semiconductor body before applying the cover layers which form mirrors on the end surfaces of the semiconductor body. The support plate is preferably made of an electrically and thermally conducting material which has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the semiconductor body.