The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1999
Filed:
Dec. 10, 1998
Tadayuki Ichimura, Settsu, JP;
Minori Yamaguchi, Akashi, JP;
Kaneka Corporation, Osaka, JP;
Abstract
Resin particles made from a resin mixture of 30 to 70 wt % of a linear low-density polyethylene I having a resin density of 0.930 to 0.935 g/cm.sup.3 and an MI of 1 g/10 minutes or higher and 70 to 30 wt % of a linear low-density polyethylene II having a resin density of 0.915 to 0.925 g/cm.sup.3 and an MI of 2 g/10 minutes or higher are impregnated under pressurization with a volatile expansion agent, and released into a low-pressure atmosphere to yield non-crosslinked linear low density polyethylene preexpanded particles, which, when subjected to expansion molding inside a mold, exhibit good moldability, and yield molded articles that have an attractive external appearance and exhibit outstanding cushioning properties.