The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1999
Filed:
Sep. 16, 1996
Applicant:
Inventors:
Yung-Tsun Lo, Hsin chu, TW;
Tzu-Hsin Huang, Hsin chu, TW;
Hua-Jen Tseng, Hsin chu, TW;
Pei-Wei Tsai, Hsin chu, TW;
Assignee:
Mosel-Vitelic, Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
118728 ; 118500 ; 118503 ; 118504 ; 20429811 ; 20429815 ; 438758 ;
Abstract
A clamp used in clamping semi-conductor wafers during processing operations permits ready release of the wafer and avoids adherence of the clamp to materials deposited onto the wafer which otherwise tend to stick the wafer to the clamp. Adhesion of the deposited materials to the clamp is avoided by providing the clamping surfaces of the clamp with a minimum surface roughness achieved by machining, grinding, etching or other techniques.