The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Oct. 02, 1998
Ching-Rong Ko, Hsinchu, TW;
Te-Wei Liu, Hsinchu, TW;
D-Link Corporation, Hsinchu, TW;
Abstract
A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided above integrated circuits of the electronic product, with a layer of thermal conductive plate disposed therebetween. The heat generated by the integrated circuit elements during operation process is transferred to the cooling fins via the thermal conductive plate. Simultaneously, the cooling fan draws in air, which is discharged, via an air outlet thereof towards the cooling fins to dissipate the heat of the cooling fins. The cooling fan can be disposed directly above the heat sink body to enhance heat dissipation efficiency. A single cooling fan will suffice to achieve good heat dissipating effects, thus reducing manufacturing cost.