The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Oct. 08, 1997
Toshimitsu Ishikawa, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A resin-mold type semiconductor device includes a semiconductor chip, a die pad for supporting and fixing the semiconductor chip, a plurality of inner leads whose distal ends face the semiconductor chip, a plurality of outer leads integrally connected to the corresponding inner leads, bonding wires for electrically connecting distal end portions of the inner leads to terminal electrodes of the semiconductor chip, a resin-mold package for molding the die pad, the semiconductor chip, the inner leads and the bonding wires, and a highly water-absorbent insulating film made of highly water-absorbent polymer formed at least one portion of the surface of the resin-mold package.