The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Jul. 08, 1997
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.