The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 1999

Filed:

Apr. 14, 1997
Applicant:
Inventors:

Toyokazu Fujii, Osaka, JP;

Mikio Nishio, Osaka, JP;

Mitsuru Sekiguchi, Osaka, JP;

Kazuhiko Hashimoto, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; H07L / ;
U.S. Cl.
CPC ...
427 97 ; 427 99 ; 427124 ; 427282 ; 427250 ; 427255 ; 438462 ; 438975 ;
Abstract

On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.


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