The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 1999

Filed:

May. 23, 1997
Applicant:
Inventor:

Yong-Ki Min, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 30 ; 438 29 ; 350290 ; 350291 ; 350310 ; 350315 ; 350316 ;
Abstract

An inventive method for manufacturing an array of M.times.N thin film actuated mirrors for use in an optical projection system includes the step of: providing a substrate; depositing a thin film sacrificial layer on top of the substrate; creating an array of M.times.N empty cavities on the thin film sacrificial layer; depositing an elastic layer; patterning the elastic layer into an array of M.times.N elastic members; forming an array of M.times.N switching device on the substrate; depositing a passivation layer and an etchant stopping layer; removing the etchant stopping layer and the passivation layer, selectively, such that elastic members are exposed; forming an array of M.times.N second thin film electrodes and an array of M.times.N thin film electrodisplacive members, successively, on top of each of elastic members; forming an array of M.times.N actuating structures; and removing the thin film sacrificial layer to thereby form the array of M.times.N thin film actuated mirrors. In order to prevent the thermal damage of the active matrix, in inventive method, an array of M.times.N switching devices are formed on the substrate after all of the high temperature processes are completed, which will, in turn, reduces the possibility of thermal damages occurring on the array of switching devices.


Find Patent Forward Citations

Loading…