The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 1999

Filed:

Mar. 06, 1997
Applicant:
Inventor:

David W Hall, Satellite Beach, FL (US);

Assignee:

Harris Corporation, Palm Bay, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ;
U.S. Cl.
CPC ...
364491 ; 364489 ;
Abstract

A method for converting an original integrated circuit (IC) design to an updated IC design for an updated manufacturing process includes accessing a mask database for the original IC design and manipulating the data by various scaling steps and other modifications. The original IC design may include contacts so the method includes the steps of performing a first downward size scaling on the mask data to scale down the original IC design, and selectively performing a second downward size scaling on the mask data to further scale down the contacts. The step of selectively performing the second downward size scaling may preferably include the steps of displaying and viewing an image of the IC design to aid in selection. The vias of the IC design may also be scaled downward. The method may also further include the step of selectively performing a downward size scaling on the mask data in at least one dimension to further scale down a size of the polysilicon gates. The method may further include the steps of selectively performing an upward size scaling on the mask data to scale up the power supply rails, and selectively performing an upward size scaling on the mask data to scale up the bond pads. The original test and alignment structures are preferably replaced by new test structures and alignment keys for the updated process, and new ESD protection may be substituted for the original ESD protection.


Find Patent Forward Citations

Loading…