The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1999
Filed:
Apr. 25, 1997
Applicant:
Inventors:
Yasushi Ideta, Kikuchi-gun, JP;
Akihiro Washitani, Kikuchi-gun, JP;
Tsunenori Umetsu, Kikuchi-gun, JP;
Keiko Kaneko, Kikuchi-gun, JP;
Kunio Kobayashi, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ; H01R / ;
U.S. Cl.
CPC ...
324755 ; 439266 ;
Abstract
A semiconductor device socket prevents adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. A positioning base of the socket supports external leads of the semiconductor device such that the lead ends of the leads do not contact a body of the socket. Movable contact terminals of the socket disposed opposite the external leads can move into and out of contact with the external leads.