The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 1999
Filed:
Feb. 25, 1998
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257 48 ; 257737 ; 324755 ; 361767 ; 439 66 ; 438 18 ;
Abstract
A plurality of solder balls are arranged at a main surface of a BGA type semiconductor device. A test terminal is provided on the main surface adjacent to the solder ball. A contact pin of an IC socket is abutted against this test terminal. Accordingly, favorable electrical connection between a contact pin and a protruding external electrode can be achieved while suppressing deformation of the external electrode in testing a semiconductor device prior to mounting.