The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 1999
Filed:
Feb. 14, 1997
Charles F Miller, Anaheim Hills, CA (US);
Other;
Abstract
An ultrasonic bonding method and apparatus utilizes a locking mechanism which limits motion of an ultrasonic bonding tool tip during formation of a bond. In a basic embodiment of tie invention, motion of the tool tip in the up/down, z-axis direction is inhibited during bond formation. Preferably motion in the longitudinal, in/out y-axis direction is also inhibited, and motion in the lateral, x-direction may optionally be limited. A separate locking mechanism or brake is provided for each orthogonal direction in which it is desired to inhibit motion during bond formation. Each brake is actuated in response to a bond initiation command signal, locking the tool tip against motion in particular coordinate directions prior to application of ultrasonic energy to a bond site, and maintaining the tip in that position for a period sufficient to melt wire insulation, weld the stripped wire to a bond site such as the microcircuit pad or lead, and allow the weld to cool and solidify. At the end of the bond formation command signal, the brake command signal is removed, allowing the tool to be moved to another bond site.