The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 1999
Filed:
Nov. 13, 1996
Yoshihiro Tohyama, Kasugai, JP;
Takanori Muramoto, Kasugai, JP;
Akihisa Hayashida, Kasugai, JP;
Hidenori Akatani, Kasugai, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
A method of producing semiconductor devices includes the steps of disposing an adhesive tape over a wafer such that an adhesive surface of said tape faces a top surface of said wafer, disposing a flexible urging member over the tape in a state that the flexible urging member causes a deformation by a gravity such that the flexible urging member causes a bulging in a downward direction toward the adhesive tape, moving the flexible urging member relatively to the adhesive tape in engagement with the adhesive tape such that the adhesive tape is deformed in conformity with the flexible urging member and the adhesive tape causes a bulging in a downward direction toward the wafer, and contacting the deformed adhesive tape on the top surface of the wafer.