The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 1999

Filed:

Jul. 22, 1997
Applicant:
Inventors:

Sharon M Cannizzaro, Roswell, GA (US);

Libbie R Terwilliger, Lilburn, GA (US);

Timothy B Tunnel, Lawrenceville, GA (US);

Wayne P Vaughn, Lilburn, GA (US);

Steven Veneman, Port Deposit, MD (US);

Assignee:

Scientific-Atlanta, Inc., Norcross, GA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438122 ; 438106 ; 438121 ;
Abstract

A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween. At least one bolt extends through a hole in the printed wiring board and into the metal case so as to squeeze together the metal case, the printed wiring board, the first and second metal lands and the grease film.


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