The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 1999

Filed:

Oct. 30, 1997
Applicant:
Inventors:

Bernard Dov Geller, Princeton, NJ (US);

Aly E Fathy, Langhorne, PA (US);

Stewart M Perlow, Marlboro, NJ (US);

Ashok Naryan Prabhu, East Windsor, NJ (US);

Ellen Schwartz Tormey, Princeton Jct., NJ (US);

Valerie Ann Pendrick, Cranford, NJ (US);

Israel Haim Kalish, West Orange, NJ (US);

Assignees:

Sarnoff Corporation, Princeton, NJ (US);

Sharp Kabushiki Kaisha, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01P / ; H05K / ;
U.S. Cl.
CPC ...
257635 ; 257691 ; 257668 ; 257664 ; 257685 ; 257728 ; 257706 ; 333204 ;
Abstract

An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.


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