The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 1999
Filed:
Sep. 25, 1997
Louis N Hutter, Richardson, TX (US);
Jeffrey P Smith, Plano, TX (US);
Texas Instrument Incorporated, Dallas, TX (US);
Abstract
A vertical PNP transistor (11) and method for making it includes forming an N- region (19) in a P substrate (12), and forming an N+ region (26) in the substrate (12) laterally surrounding and partially extending into the N- region (19). A P region (30) is formed above the N- region (19), bounded laterally by the N+ region (26) to be horizontally and vertically isolated from the substrate (12) by the N- and N+ regions (19 and 26). A layer of semiconductor material (32) is formed overall, and an N well (35) and a surrounding P well (36) are formed, each extending to the P region (30). An isolating N+ well (38) is formed surrounding the P well (36), extending to the buried N+ region (26). A P emitter region (40) and an N base contact region (41) are formed at a surface of the N well (35), and a P collector contact region (44) is formed at a surface of the P well (36). Preferably, a CMOS structure (10) may be constructed elsewhere on the substrate concurrently with at least some of the steps for making the isolated vertical PNP transistor (11). For example, in one embodiment, the step of forming a P emitter region (40), an N base contact region (41), and a P collector contact region (44) are performed as a part of the simultaneous formation of source and drain regions (47 and 48) of the CMOS structure (10) elsewhere on the substrate (12). In another embodiment, the step of forming an N base contact (54) and a P collector contact (53) are performed as a part of a simultaneous formation of source and drain regions of a CMOS structure elsewhere on the substrate. In this embodiment, a separate deeper a P emitter region (52) is formed in the N well (19) to increase the emitter X.sub.J.