The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 1999
Filed:
Apr. 23, 1996
George S Bokisa, North Olmsted, OH (US);
McGean-Rohco, Inc., Cleveland, OH (US);
Abstract
This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.