The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 1999
Filed:
Jan. 31, 1997
Fumio Narui, Tokyo, JP;
KEL Corporation, Tokyo, JP;
Abstract
A soldering apparatus has a base composed of a base plate and a column fixed on the base plate, a heating device vertically movably mounted on the column, an operational lever for moving the heating device up and down along the column, and a table horizontally movably provided on the base plate. The heating device includes a heating member with a constant-heat source and a heating head, which is attached to the heating member. The heating head is made of a material which has a high heat conductivity, and it includes a mount portion, a contact portion, and a conductive portion. This mount portion is mounted on the heating member, and the contact portion is to touch a part to be soldered of an object. The conductive portion connects the mount portion with the contact portion and conducts heat which is supplied from the heating member to the mount portion, to the contact portion. The table is movable between a loading position and a soldering position on the base plate. At the loading position, the object is loaded or discharged, and at the soldering position, the part to be soldered of the object on the table is located under the heating head.