The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 1999
Filed:
Feb. 21, 1997
Applicant:
Inventors:
Walter Wagenbrenner, Tamm, DE;
Thomas Wiesa, Vaihingen, DE;
Ralph Schimitzek, Obersulm/sulzbach, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
1563069 ; 1563073 ; 1563077 ; 1563096 ; 156 87 ; 156276 ; 156290 ; 156295 ; 156537 ;
Abstract
In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.