The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 1999
Filed:
Apr. 03, 1998
Applicant:
Inventors:
Sang S Lee, Sunnyvale, CA (US);
Che-Yuan Chen, San Jose, CA (US);
Assignee:
VLSI Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02R / ;
U.S. Cl.
CPC ...
29827 ; 257675 ; 257707 ; 257796 ; 438118 ; 438122 ;
Abstract
Methods and apparatuses for encapsulating thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks so as to prevent the formation of pinholes and IC warpage without adding bulk or additional structures. The assemblies are repositioned, through offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves to prevent warpage when the IC cools down.