The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1999
Filed:
Apr. 18, 1997
Applicant:
Inventors:
Pai-Hsiang Kao, Saratoga, CA (US);
Ranjan J Mathew, San Jose, CA (US);
Cornelio De Vera, San Jose, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438460 ; 438462 ; 438464 ;
Abstract
Disclosed are methods and apparatuses that allow the dicing of wafers containing microelectromechanical systems into singulated individual dies that is economic to use and leaves substantially no residue on the surface of the individual dies. A method for packaging the dice singulated according to the present invention is also disclosed.
Quick Actions:
Kao, Pai-Hsiang. (1999). Methods and apparatuses for singulation of microelectromechanical systems (U.S. Patent No. 5923995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5923995
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile