The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 1999

Filed:

May. 15, 1997
Applicant:
Inventors:

Shintaro Hara, Fukuoka, JP;

Hideaki Iwanaga, Fukuoka-ken, JP;

Akira Gyoutoku, Saga-ken, JP;

Takahiro Komatsu, Kasuga, JP;

Chiharu Wakamatsu, Kagoshima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B / ;
U.S. Cl.
CPC ...
313506 ; 313503 ; 313505 ; 428690 ;
Abstract

An organic thin-film electroluminescent display device comprising a substrate, hole injection electrodes, an organic thin film layer, electron injection electrodes, an electrode-driving IC for driving the electron injection electrodes and the electron injection electrodes and lead wires for connecting the hole injection electrodes and the electron injection electrodes to the electrode-driving IC. The lead wires each include a lead underlayer made of the same material of the hole injection electrode and a lead electroconductive layer formed on the lead underlayer and having a higher electroconductivity than that of the lead underlayer and or the electron injection electrodes each may include an underlayer for the electron injection electrode and an electroconductive layer for the electron injection electrode formed on the underlayer for the electron injection electrode and having a higher electroconductivity than that of the underlayer for the electron. The device injection electrode can prevent fluctuations in luminescence brightness due to different ohmic losses of lead wires connecting the hole injection electrodes and the electron injection electrodes to the electrode-driving IC and due to different electric resistances of electron injection electrodes.


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