The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 1999

Filed:

May. 19, 1997
Applicant:
Inventors:

Kenneth Michael Fallon, Rochester, NY (US);

William Hsioh-Lien Ma, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257777 ; 257723 ; 257778 ; 257787 ; 438108 ; 438127 ;
Abstract

An electronic package comprising an integrated circuit chip and a flip chip solder bonded thereto is provided. The integrated circuit chip has circuitry over a major surface thereof and has peripheral wire or tab bond pads surrounding an array of C4 connection pads located over this major surface. A flip chip is solder bonded to the C4 connection pads.


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