The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 1999

Filed:

Jun. 07, 1996
Applicant:
Inventors:

Kazuhiko Kano, Obu, JP;

Kenichi Nara, Obu, JP;

Toshimasa Yamamoto, Bisai, JP;

Nobuyuki Kato, Seto, JP;

Yoshitaka Gotoh, Toyoake, JP;

Yoshinori Ohtsuka, Okazaki, JP;

Kenichi Ao, Tokai, JP;

Assignee:

Nippondenso Co., Ltd, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
216-2 ; 438 50 ; 438 52 ; 438 53 ; 438513 ; 438518 ; 438705 ; 438723 ; 438743 ; 438766 ;
Abstract

A semiconductor sensor having a thin-film structure body, in which thin-film structure is prevented from bending due to the internal stress distribution in the thickness direction, is disclosed. A silicon-oxide film is formed as a sacrificial layer on a silicon substrate, and a polycrystalline-silicon thin film is formed on the silicon-oxide film. Thereafter, phosphorus (P) is ion-implanted in the surface of the polycrystalline-silicon thin film, and thereby the surface state of the polycrystalline-silicon thin film is modified. A portion of distribution of stress existing in the thickness direction of the polycrystalline-silicon thin film is changed by this modification, and stress distribution is adjusted. By removal of the silicon-oxide film, a movable member of the polycrystalline-silicon thin film is disposed above the silicon substrate with a gap interposed therebetween.


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