The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1999
Filed:
Sep. 30, 1997
David R Hanson, Brewster, NY (US);
Hance H Huston, III, Fishkill, NY (US);
Kris V Srikrishnan, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process applicable to the restoration of defective or rejected semiconductor wafers to a defect-free form uses etchants and a variation of the Smart-Cut.RTM. process. Because of the use of the variation on the Smart-Cut.RTM. process, diffusion regions are removed without significantly affecting the specifications of the semiconductor wafer. Therefore, a defective or rejected wafer can be restored to near original condition for use in semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile