The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 1999

Filed:

Jun. 03, 1997
Applicant:
Inventors:

Yohei Ishikawa, Kyoto, JP;

Seiji Hidaka, Nagaokakyo, JP;

Norifumi Matsui, Kyoto, JP;

Tomoyuki Ise, Nagaokakyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ; H01P / ; H01P / ; H01P / ;
U.S. Cl.
CPC ...
333204 ; 333219 ; 333238 ; 333243 ;
Abstract

A multi-layer thin-film electrode comprises thin conductor films and thin dielectric films each being alternately laminated on a dielectric substrate, in which an electro-magnetic field generated in the dielectric substrate and that generated in each of the thin dielectric films have substantially the same phase at a predetermined frequency. According to the multi-layer thin-film electrode of the present invention, adhesive conductor films that more readily form metallic oxide as compared with the thin conductor films are provided between the dielectric substrate and the thin conductor films adjacent thereto and between each of the thin conductor films and the thin dielectric film adjacent thereto, respectively, and an increase in the surface reactance of the thin conductor films caused by the adhesive conductor film formation is canceled by correcting the thickness of each of the thin dielectric films based on the dielectric constant of the thin dielectric film and the dielectric substrate and the thickness of at least one of the adhesive conductor films.


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