The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 1999

Filed:

Nov. 27, 1996
Applicant:
Inventors:

Norito Umehara, Oita, JP;

Akira Karashima, Oita, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257669 ; 257666 ; 257672 ; 257674 ; 257692 ; 257696 ; 257698 ;
Abstract

In semiconductor device fabrication, warping of the support pins must be prevented so that the semiconductor element can be properly positioned during the wire-bonding and resin-sealing processes. The invention provides a process in which a V-shaped groove 33, for example, is formed in the mounting pad 31 and the support pins 32, imparting rigidity to the support pins 32.


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