The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1999
Filed:
Dec. 28, 1995
Lucian Arthur D'Asaro, Madison, NJ (US);
Keith Wayne Goossen, Aberdeen, NJ (US);
Sanghee Park Hui, New Providence, NJ (US);
Betty Jyue Tseng, Berkeley Heights, NJ (US);
James Albert Walker, Howell, NJ (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
Each microminiature contact pad included in a dense array of pads on an electronic component contains a relatively thick layer of solder. The layer is treated to form a relatively thin brittle protective layer on the surface of the solder. The structure is then brought into contact with a contact pad in a mating array of pads on another component in a thermo-compression bonding step carried out below the melting point of the solder. In that step, the brittle layer is fractured. As a result, solid-state diffusion of conductive material occurs through fissures in the fractured layer, thereby to provide an electrical connection between mating pads on the two components.