The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Jul. 09, 1997
Applicant:
Inventor:
Nobuyuki Kasai, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257633 ; 257698 ; 257774 ; 438118 ;
Abstract
A resin-encapsulated semiconductor device includes a semi-conductor substrate having a surface including an insulating film and an electroplated transmission line. To avoid a possible separation and/or peeling of the insulating film with respect to the substrate, a gap is present between the insulating film and the plated line.
Quick Actions:
Kasai, Nobuyuki. (1999). Semiconductor device including an insulative layer having a gap (U.S. Patent No. 5917231). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5917231
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile