The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Apr. 25, 1996
Goo Chemical Co., Ltd., Kyoto, JP;
Abstract
A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist. The filling material composition used in the process comprises hydrophthalic mono ester compound as a component (A), a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B), a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of cure depth of the material after exposure of light as a component (C), and a powder of at least one extender selected from polyethelene, nylon, polyester, talc, silica, aluminum hydroxide, titanium oxide, barium sulfate, kaolinite, calcium carbonate, and phthalocyanine as a component (D).