The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Nov. 04, 1997
Applicant:
Inventors:
Youichi Ueda, Takatsuki, JP;
Yasuhiro Endo, Tsukuba, JP;
Mitsuhiro Shibata, Ibaraki-ken, JP;
Kaori Yamasaki, Ibaraki, JP;
Assignee:
Sumitomo Chemical Company, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C08G / ;
U.S. Cl.
CPC ...
428418 ; 428251 ; 428261 ; 428416 ; 525481 ; 525508 ; 525527 ; 528100 ; 528103 ;
Abstract
A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.